首页> 外文会议>NSTI(Nano Science and Technology Institute) Nanotechnology Conference and Trade Show(Nanotech 2004) >Micromachined Piezoresistive Tactile Sensor Array Fabricated by Bulk-etched MUMPs Process
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Micromachined Piezoresistive Tactile Sensor Array Fabricated by Bulk-etched MUMPs Process

机译:体蚀刻MUMP工艺制备的微机械压阻式触觉传感器阵列

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The design, fabrication and testing of a 5x5 micromachined tactile sensor array for the detection of an extremely small force (micrometer-Newton range) has been discussed. An anisotropic etching of silicon substrate of a MUMPs process chip forms a central contacting pads that are trampoline-shape suspended structures and sensor beams. A piezoresistive layer of polysilicon embedded in sensor beams is used to detect the displacement of the suspended contacting pad. Each square tactile has dimension of 200 μm x 200 μm with 250 μm center-to-center spacing. The entire sensor area is 1.25 mm x 1.25 mm. The device was tested characterized under various normal force loads using weight microneedles. The individual sensor element shows the linear response to normal force with good repeatability.
机译:已经讨论了用于检测到极小的力(MICROMET-NEWTON系列)的5×5微机械触觉传感器阵列的设计,制造和测试。腮腺组处理芯片的硅衬底的各向异性蚀刻形成具有蹦床形悬挂结构和传感器梁的中央接触垫。嵌入在传感器梁中的压阻多晶硅层用于检测悬挂接触垫的位移。每个方形触觉具有200μmx200μm的尺寸,中心到中心间距为250μm。整个传感器面积为1.25 mm x 1.25 mm。使用重量微针在各种法正常力负载下进行测试。各个传感器元件显示具有良好重复性的正常力的线性响应。

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