The Effects of Operating Conditions on the Thermal Response of a Card Assembly during Infrared Reflow Soldering

摘要

A numerical study is performed to predict the thermal response of a card assembly during infrared reflow soldering to attach electronic components to a printed circuit board. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to analyze the sensitivity of the thermal response of electronic components to various conditions such as conveyor speed, exhaust velocities and emissivities.