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New Technique Prevents Proppant Flowback and Improves Fracture Conductivities

机译:新技术可防止支撑剂倒流并提高断裂电导率

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Flowback of fracturing proppant during production is acommon problem. The consequences of this can be extremelyserious. Loss of fracture conductivity can occur due toreduced width, which can be further compounded by partialplugging of the pack by proppant fines. The latter areproduced by non-uniform loading on the proppant withresultant failure and crushing. The produced solids can wreakhavoc with both downhole and surface equipment, erodingchokes and nipples, plugging flow lines and filling separators.In the case of subsea wells, the problems are even greater andcan compromise well security. Since the 1980's, the standardsolution applied for prevention of proppant flow back has beenthe use of curable resin coated proppant. While this approachhas met with some success, it is far from perfect. The use ofRCP's can cause fluid compatibility problems and can interferewith well clean up. Such problems have prompted resinmanufacturers to modify their products and have also openedthe door for the introduction of new technologies. Newerdevelopments have included the use of small fibres to try tobind the proppant pack together or heat-sensitive plastic filmto partially encapsulate clusters of proppant. These materialshave reportedly been used with some success but concernshave been raised with regard to their effect on fractureconductivity, amongst other things.This paper describes the current methods in use andpresents a new system that actually enhances fractureconductivity and minimises embedment and width-loss, whilesimultaneously helping prevent proppant back-production.
机译:生产过程中压裂支撑剂的回流是 常见问题。这样的后果可能非常严重 严肃的。断裂电导率的损失可能是由于 减小的宽度,这可以通过局部调整进一步复杂化 通过支撑剂罚款堵塞包装。后者是 通过不均匀地支撑在支撑剂上而产生的 结果导致故障和压坏。产生的固体会碎裂 井下和地面设备均遭受严重破坏 扼流圈和奶嘴,堵塞流水线和填充分离器。 就海底油井而言,问题甚至更大,而且 会危及井的安全性。自1980年代以来,标准 用于防止支撑剂倒流的解决方案是 使用可固化的树脂涂层支撑剂。虽然这种方法 取得了一些成功,但远非完美。指某东西的用途 RCP可能会引起流体兼容性问题并可能造成干扰 清理得很好。这样的问题促使树脂 制造商修改他们的产品并且也已经开放 引入新技术的大门。较新的 发展包括使用小纤维来尝试 将支撑剂包或热敏塑料膜粘合在一起 部分封装支撑剂簇。这些材料 据报道已成功使用了一些,但令人担忧 关于其对骨折的影响已被提出 电导率等。 本文介绍了当前使用的方法和 提出了一个实际上可以增强骨折的新系统 导电性并最大程度地减少嵌入和宽度损失,同时 同时帮助防止支撑剂的反向生产。

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