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Post-Exposure Bake Kinetics in Epoxy Novolac-Based Chemically Amplified Resists

机译:环氧树脂基于酚醛清漆的化学放大抗蚀剂的曝光后烘烤动力学

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The chemical mechanism and the kinetics of photoacid initiated crosslinking reactions in epoxy novolac based chemically amplified resists are consistent with the strong cage effect observed during post exposure bake (PEB) in these resists. FTIR has confirmed that the acid initiating the crosslinking reaction is bound to the polymer and suggests that the bulky carbonium intermediate is the actually moving species. Single pixel e-beam exposures used to measure the influence of acid diffusion in lithographic feature dimensions show limited diffusion with increasing PEB time. Microlithographic results from deep UV and e-beam controlled at the PEB codnitiosn of lithographic interest: the conditions that favour reactant diffusion facilitate raction completion and increase resist contrast but can restrict resolution. Thermomechanical analysis and differential scannign calorimetry results are in agreement with the above observation.
机译:在基于环氧线型酚醛清漆的化学放大型抗蚀剂中,光酸引发的交联反应的化学机理和动力学与这些抗蚀剂在曝光后烘烤(PEB)期间观察到的强笼效应相符。 FTIR已证实引发交联反应的酸与聚合物结合,并表明大块的碳中间体是实际移动的物种。用于测量酸在光刻特征尺寸中扩散的影响的单像素电子束曝光显示,随着PEB时间的增加,扩散受限。微光刻的结果来自深紫外光和电子束的控制,而深紫外光和电子束受制于PEB光刻技术:有利于反应物扩散的条件有利于完成反应并提高抗蚀剂对比度,但会限制分辨率。热力学分析和差示扫描量热法结果与上述观察结果一致。

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