首页> 外文会议>Electronics Industries Forum of New England, 1997. Professional Program Proceedings >Advanced automation technology for photonics packaging delivers improved device performance and lower cost
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Advanced automation technology for photonics packaging delivers improved device performance and lower cost

机译:用于光子学封装的先进自动化技术可提高设备性能并降低成本

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Automation is playing an increasingly key role in photonics device manufacturing now that the markets are demanding larger volumes. High-precision machinery is now becoming commercially available which can offer turn-key production solutions to photonics assembly and test applications. Automated alignment and device testing, along with more robust attachment techniques (like laser welding), are improving device-to-device consistency, enhancing package environmental resistance, lowering costs and enabling manufacturers to maximize the performance of their devices and their systems.
机译:鉴于市场需求量越来越大,自动化在光子学设备制造中扮演着越来越重要的角色。高精度机械现在正在商业上可用,可以为光子学组装和测试应用提供交钥匙的生产解决方案。自动对准和设备测试以及更强大的连接技术(例如激光焊接)正在改善设备之间的一致性,增强封装的耐环境性,降低成本,并使制造商能够最大程度地提高其设备和系统的性能。

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