首页> 外文会议>Electron Devices Meeting, 1996., International >Low operation voltage field emitter arrays using low work function materials fabricated by transfer mold technique
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Low operation voltage field emitter arrays using low work function materials fabricated by transfer mold technique

机译:使用通过传递模具技术制造的低功函数材料的低工作电压场发射极阵列

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Extremely sharp, uniform, and low operation voltage field emitter arrays (FEAs) using low work function materials such as LaB/sub 6/ and TiN have been developed by the Transfer Mold emitter fabrication technique to realize high efficient and high reliable devices for the first time. Because of the sharpening effect on the tips by thermally oxidized SiO/sub 2/ layer of the molds, emitter tip radii are as small as less than 10 nm (2.5-5 nm). The turn-on voltages of LaB/sub 6/ and TiN FEA are 110-130 V lower than that of conventional Mo FEA. That of the gated LaB/sub 6/ FEA is as low as 28 V even without high vacuum baking treatment. Transfer Mold technique provides superior uniformity, sharpness and easiness of selecting low work function materials including diamond which might have negative electron affinity.
机译:通过传递模发射极制造技术,开发了使用低功函数材料(例如LaB / sub 6 /和TiN)的极其锋利,均匀且低工作电压的场发射极阵列(FEA),从而首次实现了高效,高可靠性的器件时间。由于模具的热氧化SiO / sub 2 /层对尖端产生尖锐作用,因此发射器尖端半径小至小于10 nm(2.5-5 nm)。 LaB / sub 6 /和TiN FEA的开启电压比常规Mo FEA的开启电压低110-130V。即使不进行高真空烘烤处理,LaB / sub 6 / FEA栅极的电压也可低至28V。传递模具技术提供了卓越的均匀性,清晰度和易用性,可以选择低功函材料(包括可能具有负电子亲和力的金刚石)。

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