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Morphology of Nanowire Arrays Produced by Metal-Assisted Chemical Etching on Si Wafers of Different Types: Comparative Analysis

机译:不同类型的Si晶片上的金属辅助化学蚀刻产生的纳米线阵列的形态:对比分析

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The results of studies on fabrication of silicon nanowires on the surface of silicon wafers of different types using the metal-assisted chemical etching method are presented. The influence of the deposition time of Ag particles on their morphology and filling density on the surface of silicon wafers has been analyzed. At different etching time of wafer samples of n-type in a HF-H2O2 based etching solution, vertically aligned arrays of solid nanowires are obtained. It is shown that changing the duration of Ag nanoparticles deposition at the same etching time, it is possible to change the distance between the nanowire stacks. It was established that under identical technological conditions the nanowires were not formed on a p-Si wafer. The results are discussed from the point of view of the specific etching mechanism of Si wafers with different type of conductivity and crystallographic orientation.
机译:介绍了使用金属辅助化学蚀刻方法在不同类型的硅晶片表面上制造硅纳米线的研究结果。分析了Ag颗粒对其形态和填充密度的沉积时间对硅晶片表面的影响。在基于HF-H 2 O 2的蚀刻溶液中N型晶片样品的不同蚀刻时间,得到垂直排列的固体纳米线阵列。结果表明,在相同的蚀刻时间改变Ag纳米颗粒沉积的持续时间,可以改变纳米线堆叠之间的距离。建立在相同的技术条件下,纳米线未形成在P-Si晶片上。从具有不同类型的电导率和晶体取向的Si晶片的特定蚀刻机制的特定蚀刻机构的观点来讨论结果。

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