首页> 外文会议>International Conference on Numerical Simulation of Optoelectronic Devices >Transient Simulations and Analyses of Thermally Tunable Devices
【24h】

Transient Simulations and Analyses of Thermally Tunable Devices

机译:热可调器件的瞬态仿真和分析

获取原文

摘要

we present transient simulations and analytic formulas for the thermally tunable devices with suspended waveguide. The response speeds can be improved about 10% and 40%, when the thickness of metallic heater varies from 0.08 μm to 0.16 μm and the cladding thickness increases from 0.4 μm to 1.2 μm, respectively. Moreover, replacing the cladding of silica by ones of Alumina, aluminum nitride and silicon nitride, the response speed have a significant boost, more than 65%.
机译:我们提供了具有悬浮波导的热可调器件的瞬态仿真和解析公式。当金属加热器的厚度从0.08μm变为0.16μm,覆层厚度从0.4μm增大至1.2μm时,响应速度可以提高大约10%和40%。此外,用氧化铝,氮化铝和氮化硅代替二氧化硅的覆层,响应速度显着提高,超过65%。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号