RELATION BETEWEEN GROWTH OF SELECTED PHASES IN Ni/Al/Ni SYSTEM DURING DIFFUSION SOLDERING PROCESS

摘要

Diffusion soldering (DS) method is a promising technology to obtain durable and reliable interconnection between substrates of high melting temperature joined with low-melting solder metal or alloy. This technique can be also described as combination of the conventional soldering and diffusion bonding. The assembly consisting of two substrates and a filler between them, is heated up above melting temperature of the latter and then is held at the set temperature for appropriate time period. As a result various intermetallic phases can be formed. Initially the interconnection zone is broadening, while later, due to the isothermal solidification, the joining zone is shrinking [1, 2].