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Developing Intelligent Structures and Devices Using Novel Smart Materials and Multi- Material Multi-Method (m~4) 3D Printing

机译:使用新型智能材料和多材料多方法(m〜4)3D打印技术开发智能结构和设备

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The advent of additive manufacturing (AM), commonly known as 3D printing, has enabled the rapid fabrication of complex structures previously unrealizable with traditional manufacturing techniques. Current approaches, however, are limited to single materials or single methodologies greatly limiting the potential scope of manufacturable products and components. Recently, our group has developed a novel multi-material multi-method (m~4) 3D printer which integrates four AM technologies and two complementary technologies into one single platform. This allows for the fabrication of complex devices able to provide a wide range of functionalities ranging from stretchable electronics to self-sensing devices. To demonstrate these functionalities in the realm of printable electronics, multiple proof of concept printed circuit boards (PCBs) were fabricated which solve issues commonly encountered in 3D printed electronics such as high resolution or vertically integrated access (VIA) circuits. In addition, 3D printed smart structures able to respond to external stimulus, such as light or heat, have become highly desirable for applications ranging from soft robotics to implantable medical devices. Recently, our group has turned to liquid crystal elastomers (LCE), a class of active material able to generate large, rapid, and reversible actuations. Therefore, using the m~4 3D printer, LCE-based smart structures requiring complex electronics were fabricated which can change their shape in response to an applied current. To demonstrate this, a smart, reconfigurable radio frequency (RF) antenna was 3D printed which can change its shape and operating frequency as a function of the applied current. These examples demonstrate the vast potential of m~4 3D printing for creating smart, reconfigurable, and multi-functional structures.
机译:增材制造(AM)的出现(通常称为3D打印)使得能够快速制造以前无法通过传统制造技术实现的复杂结构。但是,当前的方法仅限于单一材料或单一方法,极大地限制了可制造产品和组件的潜在范围。最近,我们小组开发了一种新颖的多材料多方法(m〜4)3D打印机,它将3种AM技术和2种互补技术集成到一个平台中。这允许制造复杂的设备,该设备能够提供从可伸缩电子设备到自感应设备的广泛功能。为了在可印刷电子领域中展示这些功能,制造了多种概念验证的印刷电路板(PCB),解决了3D打印电子产品中经常遇到的问题,例如高分辨率或垂直集成访问(VIA)电路。此外,对于从软机器人到可植入医疗设备的各种应用,能够对外部刺激(例如光或热)做出响应的3D打印智能结构已变得非常理想。最近,我们的小组转向了液晶弹性体(LCE),它是一类能够产生大,快速和可逆的驱动力的活性材料。因此,使用m〜4 3D打印机,制造了需要复杂电子器件的基于LCE的智能结构,这些结构可以响应施加的电流而改变其形状。为了证明这一点,对3D打印的智能可重构射频(RF)天线可以根据所施加的电流来改变其形状和工作频率。这些示例展示了m〜4 3D打印在创建智能,可重新配置和多功能结构方面的巨大潜力。

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