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A current sensorless IGBT junction temperature extraction method via parasitic parameters between power collector and auxiliary collector

机译:集电极与辅助集电极之间寄生参数的无电流IGBT结温提取方法

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The extraction of junction temperature Tj plays a critical role in the IGBT module reliability. In recent years, the extraction of Tj via parasitic parameters has drawn much attention for its ability to be integrated in the driver circuit. However, the aging of modules can affect the parasitic parameters, leading to the inaccuracy of Tj extraction when fatigue and aging occurs. Firstly, this paper analyzes the inner structure and equivalent circuit of IGBT modules in detail and proves the parasitic parameters of collector far less susceptible from aging than parameters of gate and emitter. Secondly, an enhanced Tj extraction method via the parasitic parameters between the power collector and auxiliary collector is presented. Besides, Due to the decoupling of this method from the driver current, the load current can be acquired accurately with an integrator, which exempts the extraction from the need of a current sensor. Finally, a series of verification tests are handled to verify the validation and accuracy of the method.
机译:结温Tj的提取在IGBT模块的可靠性中起着至关重要的作用。近年来,通过寄生参数提取Tj引起了人们的广泛关注,因为它具有集成在驱动器电路中的能力。但是,模块的老化会影响寄生参数,导致在发生疲劳和老化时Tj提取不准确。首先,本文详细分析了IGBT模块的内部结构和等效电路,并证明了集电极的寄生参数比栅极和发射极的参数更不易老化。其次,提出了一种通过集电器和辅助集电器之间的寄生参数改进的Tj提取方法。此外,由于该方法与驱动器电流解耦,因此可以使用积分器准确获取负载电流,从而无需提取电流传感器。最后,将进行一系列验证测试以验证该方法的有效性和准确性。

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