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Investigations on device design parameters of all-oxide transparent charge-trap memory thin-film transistors

机译:全氧化物透明电荷陷阱存储薄膜晶体管的器件设计参数研究

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Charge-trap memory thin film transistors employing In-Ga-Zn-O thin films as active channel and charge-trap layers (CTLs) were fabricated and characterized. To optimize process conditions, the design parameters were categorized into two parts. First, the thickness effects of double-layered tunneling oxide were examined and the 5 nm/5 nm configuration was chosen for guaranteeing process window and device performance. Secondly, the CTL thickness effects were investigated and the device using 30 nm-thick CTL showed most desirable behaviors including superior memory operation and device uniformity. The CTL geometry was also found to have significant impact on nonvolatile memory operations.
机译:制作并表征了采用In-Ga-Zn-O薄膜作为有源沟道和电荷陷阱层(CTL)的电荷陷阱存储薄膜晶体管。为了优化工艺条件,设计参数分为两部分。首先,检查了双层隧穿氧化物的厚度效应,并选择了5 nm / 5 nm配置以保证工艺窗口和器件性能。其次,研究了CTL厚度的影响,使用30 nm厚的CTL的器件表现出最理想的行为,包括出色的存储操作和器件均匀性。还发现CTL几何形状对非易失性存储器操作有重大影响。

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