首页> 外文会议>Symposium on VLSI Technology >Undoped Ge0.92Sn0.08 quantum well PMOSFETs on (001), (011) and (111) substrates with in situ Si2H6 passivation: High hole mobility and dependence of performance on orientation
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Undoped Ge0.92Sn0.08 quantum well PMOSFETs on (001), (011) and (111) substrates with in situ Si2H6 passivation: High hole mobility and dependence of performance on orientation

机译:(001),(011)和(111)衬底上原位Si 2 H 0.92 Sn 0.08 量子阱PMOSFET > 6 钝化:高空穴迁移率以及性能对取向的依赖性

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We demonstrate high performance undoped Ge0.92Sn0.08 quantum well (QW) pMOSFETs with in situ Si2H6 passivation on (001), (011) and (111) orientations. (011) and (111)-oriented Ge0.92Sn0.08 QW pFETs achieve higher on-state current ION and effective hole mobility μeff compared to (001) devices. Ge0.92Sn0.08 (111) QW pFETs demonstrate a record high μeff of 845 cm2V−1s−1 for GeSn p-channel devices (Fig. 1). This is enabled by incorporating high biaxial compressive strain (1.43%) and eliminating dopant impurity scattering in the defect-free GeSn channel.
机译:我们演示了在(001),(011)和(111)方向上具有原位Si2H6钝化的高性能非掺杂Ge0.92Sn0.08量子阱(QW)pMOSFET。与(001)器件相比,面向(011)和(111)的Ge0.92Sn0.08 QW pFET实现了更高的导通电流ION和有效的空穴迁移率μeff。 Ge0.92Sn0.08(111)QW pFET对GeSn p沟道器件展示了845 cm2V-1s-1的创纪录的高μeff(图1)。通过合并高双轴压缩应变(1.43%)并消除无缺陷GeSn通道中的掺杂剂杂质扩散,可以实现这一点。

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