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Effect of Compound Modification and Cooling Rate on Microstructure and Mechanical Properties of Al-25Si Alloy

机译:化合物改性和冷却速率对Al-25%Si合金微观结构和力学性能的影响

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The effect of phosphorus on primary silicon, phosphorus and mischmetal (Ce-50La) modification on primary and eutectic silicon and cooling rate on microstructure of Al-25%Si are investigated. The results show that, with the addition of phosphorus, the size of primary silicon decreases from 93.6μm to 24.75μm. The morphology of primary silicon changes from irregular to polygonal. When Al-25%Si is modified by phosphorus and mischmetal, primary and eutectic silicon all change effectively. Addition of mischmetal on the basis of phosphorus modification have no influence to primary silicon, but it can make morphology of eutectic silicon change from lamellar to short rod-like when the content of mischmetal reaches 0.5%. The cooling rate curves show the change of temperature in different height of wedge-shaped mould. When cooling rate increases, microstructure of Al-25%Si refines, the size of primary silicon decrease to 22.7μm. The results obtained from mechanical testing demonstrate that the addition of mischmetal and increasing of cooling rate increase hardness value of Al-25%Si alloy.
机译:研究了磷对初级硅,磷和模糊(CE-50LA)修饰对初级和共晶硅的影响,以及对Al-25%Si的微观结构进行的冷却速率。结果表明,随着磷的添加,初级硅的尺寸从93.6μm降低至24.75μm。初级硅的形态从不规则到多边形变化。当Al-25%Si通过磷和模氏磷来修饰时,初级和共晶硅都有效地改变。在磷改性的基础上添加模糊物质对初级硅没有影响,但是当模氏含量达到0.5%时,它可以使从层状到短杆状的共晶硅的形态。冷却速率曲线显示楔形模具的不同高度温度的变化。当冷却速率增加时,Al-25%Si的微观结构精制,初级硅的尺寸减小至22.7μm。从机械测试中获得的结果表明,添加模糊物质和越来越多的冷却速率增加了Al-25%Si合金的硬度值。

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