Flip-chip integration of 4-channel transimpedance amplifier chip on a Si/Ge-based photonic circuit

机译：基于Si / Ge的光子电路上4通道互阻放大器芯片的倒装芯片集成

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We have developed a photonic receiver in which a 4-channel transimpedance amplifier (TIA) chip is integrated on a Si/Ge-based photonic circuit by using flip-chip bonding. The TIA outputs exhibit a clearly opened 25-Gbit/s eye pattern.

机译：我们已经开发出一种光子接收器，其中通过倒装芯片键合将4通道跨阻放大器（TIA）芯片集成在基于Si / Ge的光子电路上。 TIA输出显示出清晰可见的25 Gbit / s眼图。

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《IEEE International Conference on Group IV Photonics》|2014年|104-105|共2页
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Takeda K.; Usui M.; Okazaki K.; Hiraki T.; Tsuchizawa T.; Nishi H.; Kou R.; Honda K.; Fukuda H.; Ishikawa Y.; Wada K.; Yamada K.; Nogawa M.; Yamamoto T.;
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flip-chip devices; germanium; integrated optics; operational amplifiers; optical receivers; photodiodes; silicon; 4-channel transimpedance amplifier chip; Si-Ge; Si/Ge-based photonic circuit; TIA outputs; bit rate 25 Gbit/s; eye pattern; flip-chip bonding; flip-chip integration; photonic receiver; Bandwidth; Bonding; Flip-chip devices; Frequency response; Photonics; Receivers; Silicon; Ge phododiode; Si photonics; flip-chip bonding; transimpedance amplifier;

机译：倒装芯片器件;锗;集成光学器件;运算放大器;光接收器;光电二极管;硅; 4通道互阻放大器芯片; Si-Ge;基于Si / Ge的光子电路; TIA输出;比特率25 Gbit / s;眼睛图案;倒装芯片键合;倒装芯片集成;光子接收器;带宽;键合;倒装芯片器件;频率响应;光子学;接收器;硅;锗光电二极管;硅光子学;倒装芯片键合;跨阻放大器;

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专利

1. Hybrid integration of GaAs pin-photodiodes with CMOS transimpedance amplifier circuits [J] . Nakahara T., Tsuda H. Electronics Letters . 1998,第13期

机译：GaAs引脚光电二极管与CMOS跨阻放大器电路的混合集成
2. Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding [J] . Matsumoto Takeshi, Kurahashi Teruo, Konoike Ryotaro, Journal of Lightwave Technology . 2019,第2期

机译：基于倒装芯片键合的SOA在硅光子平台上的混合集成
3. The Design and Analysis of Monolithic Integration of CMOS-Compatible Plasmonic Waveguides for On-Chip Electronic–Photonic Integrated Circuits [J] . Kim, J.T., Park, Journal of Lightwave Technology . 2013,第18期

机译：片上电子-光子集成电路CMOS兼容的等离子波导管的单片集成设计与分析
4. Flip-chip integration of 4-channel transimpedance amplifier chip on a Si/Ge-based photonic circuit [C] . Takeda K., Usui M., Okazaki K., IEEE International Conference on Group IV Photonics . 2014

机译：基于Si / GE的光子电路上的4通道跨阻放大器芯片的倒装芯片集成
5. Aluminum gallium nitride/gallium nitride high-electron-mobility-transistors based flip-chip integrated broadband power amplifiers [D] . Xu, Jian 2000

机译：基于氮化铝镓/氮化镓高电子迁移率晶体管的倒装芯片集成宽带功率放大器
6. Study on Modulation Bandwidth and Light Extraction Efficiency of Flip-Chip Light-Emitting Diode with Photonic Crystals [O] . Hong Wang, Ming Zhong, Lijun Tan, 2019

机译：光子晶体倒装芯片发光二极管的调制带宽和光提取效率的研究
7. Flip-Chip Integration of InP to SiN Photonic Integrated Circuits [O] . Michael Theurer, Martin Moehrle, Ariane Sigmund, 2020

机译：INP倒装芯片集成SIN光子集成电路
8. Integration of Semiconductor Optical Amplifiers in Wavelength Division Multiplexing Photonic Integrated Circuits. Application of Selective Area Chemical Beam Epitaxy. [R] . Harmsma, P. J. 2000

机译：半导体光放大器在波分复用光子集成电路中的集成。选区化学束外延的应用。

Flip-chip integration of 4-channel transimpedance amplifier chip on a Si/Ge-based photonic circuit

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