Thermal-aware architecture and mapping for multi-channel three-dimensional DRAM systems

摘要

In this work, we propose a thermal-aware DRAM architecture and mapping for the multiple-channel three-dimensional DRAM system. A thermal-aware DRAM architecture with dual control and precharge circuits (Dual-CP) is proposed to avoid the accumulated temperature by the stacking of the control and precharge circuits. A thermal-aware bank remapping (BRMAP) is proposed to avoid the active banks in the adjacent DRAM layers.