A MEMS floating element shear stress sensor with bumps has been designed in a 1cm by 1cm chip. The array consists of 256 individual floating elements (16 groups), and each element supports 35 bumps on the top surface. The sensor was fabricated using four layers of surface micromachining including copper & nickel electroplating. The chip is packaged in a ceramic package and flush mounted into a flow channel. Experimental characterization indicates: a) a static sensitivity of 0.6 fF/Pa in the laminar flow range of Reynolds number = 0～1500; b) a linear range up to 13 Pa shear stress; c) a resolution of 44 mPa/rtHz; d) a first mode resonant frequency of 18 kHz.
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