Organic substrate has been the essential component for packaging various devices and can be categorized to rigid, and flexible one. The flexible type of substrates can be manufactured by the continuous long sheet wound on reel, while the rigid type of substrate is produced using panels preliminarily cut as the rectangular shape, whose size is different depending on the maker. However, as the thickness of package substrate decreases, the rigid type of substrate can be also handled in the roll and reel type equipment and had been manufactured since about 15 years ago even though the substrate has been confined to only two layer structure. In this report, it is attempted to describe how the first mass production of multi-layered structures such as 3 layered or 4 layered substrates have been made and what are limitations and challenges. The first product was 4 layered substrate for memory device which included $mathrm{30} mu mathrm{m}$ of line width, $mathrm{100} mu mathrm{m}$ of core thickness and 45 µm of build-up layer thickness, and followed by the next one consisting of 3 layered and $mathrm{25} mu mathrm{m}$ of line width. For this first mass production of multi-layered rigid substrate, all the equipment has been prepared for reel to reel processes, including the uncoiling and recoiling parts using rolls and reels. Reel-to-Reel processes for multi-layered package have a very critical advantage that the substrate can be mass-produced very cost-effectively. In addition to the cost, much thinner substrate may be possible and more uniform qualities can be achieved, using continuous type of reel-to-reel processes. The thin panel is very hard to handle without mechanical damages but the reel type is very advantageous because the tension control is possible on continuous process, which enables the lower thickness of substrates. In addition, the reel-to-reel process can allow the properties along rolling direction to be more uniform, and asymmetry can occur only on the transverse direction, which results in better qualities of final products, also.
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机译：有机基材是用于包装各种装置的必要组件，并且可以分类为刚性和柔性的装置。柔性类型的基板可以通过卷轴上的连续长片来制造，而使用初步切割为矩形形状的刚性衬底的刚性型基板制造，其尺寸取决于制造商的尺寸不同。然而，随着封装基板的厚度减小，刚性型基板也可以在卷筒和卷轴型设备中处理，并且即使基板仅限于两个层结构，也可以在大约15年前制造。在本报告中，已经尝试描述了多层结构的第一批量生产，例如3层或4个层叠基板的诸如3层基板的群体以及有什么限制和挑战。第一产物是包括的存储装置4层基板，其包括在内 $ mathrm {30} mu mathrm {m} $ 线宽， $ mathrm {100} mu mathrm {m} $ 芯厚度和45μm的堆积层厚度，然后是下一个由3层和3个组成的 $ mathrm {25} mu mathrm {m} $ 线宽。对于该多层刚性基板的第一批量生产，所有设备都准备用于卷轴以卷轴工艺，包括使用辊和卷轴的未磁性和重塑部件。多层封装的卷轴对卷轴工艺具有非常关键的优点，即基板可以非常有效地批量生产。除了成本之外，可以使用连续类型的卷卷卷轴工艺来实现更薄的基板，并且可以实现更均匀的质量。薄面板非常难以处理而没有机械损坏，但卷轴类型是非常有利的，因为在连续过程中可以进行张力控制，这使得厚度的基板厚度较低。另外，卷轴到卷轴工艺可以允许沿滚动方向沿滚动方向均匀的性质，并且仅在横向方向上仅发生不对称性，这也导致最终产品的更好品质。
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