Development of a Process for Stacking Planar Functional Materials with μm-overlay Accuracy

摘要

To assemble multilayered systems with a high overlay accuracy using a stacking procedure, an assembly- and alignment process was developed, which guarantees the conservation of the alignment status of the layers that get covered afterwards by subsequently assembled parts. This paper describes the basic principle of the stacking procedure and the necessary process steps. The required tools for handling and positioning will be discussed with respect to their precision requirements to reach μm-overlay accuracy. Functional requirements to the assembly devices, like actuators, grippers and the imaging system will be discussed. The achieved alignment accuracies, depending on the assembly tasks and the components, will be given by illustrating the assembly of ceramic multilayers and PCBs (Printed Circuit Boards).