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Wear Behaviour of PCD Micro-tool While Vertical Micro- grinding of BK7 Glass

机译:BK7玻璃垂直微研磨时PCD微型工具的磨损行为

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Being brittle material, glass material is usually fabricated using photolithography and etching process, which are time consuming as well as involve chemical hazards. Therefore, researches are being carried out for fabricating glass micro features by various micromachining processes like grinding, milling, and turning. However, one of the major problems existing in these micromachining processes is the tool wear. This becomes more severe in the case of micro-grinding than in conventional grinding since micro grinding wheel is more sensitive to tool wear. Hence, this paper deals with the wear behavior of Polycrystalline Diamond (PCD) micro tool during micro grinding of Bk7 glass. An on-machine fabricated PCD tool of 670 μm diameter was used to micro-ground almost 65 slots keeping the same cutting conditions of feed rate 10μm/mint, depth of cut 5μm, and spindle speed 2000 rpm. It was found that tool wear caused the diameter reduction as well as length reduction. SEM image of the tool surface gave the clear indication of edge chipping and abrasion type of tool wear where grain pull out, microcracks and built up edge mechanism are responsible for these wear mode.
机译:玻璃材料是脆性材料,通常使用光刻和蚀刻工艺制造,这既费时又涉及化学危害。因此,正在进行通过各种微机械加工工艺,例如研磨,铣削和车削来制造玻璃微特征的研究。然而,这些微加工过程中存在的主要问题之一是工具磨损。在微研磨的情况下,这比在常规研磨中更为严重,因为微研磨轮对工具磨损更敏感。因此,本文探讨了在Bk7玻璃微研磨过程中多晶金刚石(PCD)微型工具的磨损行为。使用直径为670μm的机加工PCD工具对近65个槽进行微研磨,以保持相同的切削条件,进给速度为10μm/ min,切削深度为5μm,主轴转速为2000 rpm。发现工具磨损导致直径减小以及长度减小。刀具表面的SEM图像清楚地表明了刃口崩刃和磨损类型,其中晶粒拉出,微裂纹和堆积的刃口机制是造成这些磨损方式的原因。

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