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Novel Compact Model for Multi-Level Spin Torque Magnetic Tunnel Junctions

机译:多级自旋扭矩磁隧道结的新型紧凑型型号

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Spin-transfer torque (STT) and spin-orbit torque (SOT) based magnetic tunnel junction (MTJ) devices are emerging as strong contenders for the next generation memories. Conventional STT magneto-resistive random access memory (MRAM) offers lower power, non-volatility and CMOS process compatibility. However, higher current requirement during the write operation leads to tunnel barrier reliability issues and larger access devices. SOT-MRAM eliminates the reliability issues with strong spin polarized current (100%) and separate read/write current paths; however, the additional two access transistors in SOT-MRAM results into increased cell area. Multilevel cell (MLC) structure paves a way to circumvent the problems related to the conventional STT/SOT based MTJ devices and provides enhanced integration density at reduced cost per bit. Conventional STT/SOT-MRAM requires a unit cell area of ~10-60 F~2 and reported simulations have been based on available single-level MTJ compact models. However, till date no compact model exists that can capture the device physics of MLC-MTJ accurately. Hence, a novel compact model is proposed in this paper to capture the accurate device physics and behaviour of the MLC-MTJs. It is designed for MLCs with different MTJ configurations demonstrated so far, such as series and parallel free layer based MLC-MTJs. The proposed model is coded in Verilog-A, which is compatible with SPICE for circuit level simulations. The model is in close agreement with the experimental results exhibiting an average error of less than 15%.
机译:基于旋转转移扭矩(STT)和旋转轨道扭矩(SOT)的磁隧道结(MTJ)器件被出现为下一代存储器的强竞争者。传统的STT磁阻随机存取存储器(MRAM)提供较低的功率,非易用率和CMOS工艺兼容性。然而,在写入操作期间的电流要求导致隧道屏障可靠性问题和更大的接入设备。 SOT-MRAM消除了具有强旋转极化电流(100%)和单独读/写电流路径的可靠性问题;然而,SOT-MRAM中的附加两个接入晶体管导致增加的细胞区域。多级单元(MLC)结构铺平了一种方法来规避与传统的STT / SOT基MTJ器件相关的问题,并以降低的成本提供增强的集成密度。传统的STT / SOT-MRAM需要一个单位单元面积为约10-60 f〜2,并且报告的仿真已经基于可用的单级MTJ紧凑型型号。但是,直到日期,不存在距离的紧凑型模型,可以准确地捕获MLC-MTJ的设备物理。因此,本文提出了一种新型紧凑型模型,以捕获MLC-MTJS的准确装置物理和行为。它专为迄今为止显示的具有不同MTJ配置的MLC,例如基于串联和并行自由层的MLC-MTJS。所提出的模型是在Verilog-A中编码的,它与电路电平模拟的Spice兼容。该模型与实验结果密切一致,实验结果表明平均误差小于15%。

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