Vertical interconnect measurement techniques based on double-sided probing system and short-open-load-reciprocal calibration

摘要

This work develops a double-sided probing system and calibration method for measuring the S-parameters of vertical interconnects at the wafer, package and socket level. The applicable device under test (DUTs) include through silicon vias (TSVs), plated through holes (PTHs), pogo pins and pressure sensitive conductive rubbers (PCRs). The effects of solder bumps and balls can also be taken into account. A short-open-load-reciprocal (SOLR) calibration method is used with a reciprocal thru to instead of the conventional short-open-load-thru (SOLT) which uses a standard thru. The S-parameters can be measured up to 40 GHz with a repeatable S21 parameter accuracy of better than 0.2 dB and 1 degree in magnitude and phase, respectively. Additionally, the eye diagrams are measured at a maximum data rate of 40 Gb/s and a minimum rise time of 10 ps with the help of Agilent physical layer test system (PLTS).