首页> 外文会议>61st Electronic Components Technology Conference, 2011 >In-plane/out-of-plane mixed probe techniques to obtain the RF characteristics of SMA connectors
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In-plane/out-of-plane mixed probe techniques to obtain the RF characteristics of SMA connectors

机译:平面/平面外混合探针技术可获取SMA连接器的RF特性

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In this study, a Short-Open-Load-Reciprocal (SOLR) calibration procedure is conducted to obtain the RF characteristics of an adaptor (the traces between the edge of the package and the SMA connectors) on a test board. The RF characteristics are used in a post-processing technique to obtain the true RF performance of the IC inside the package. Due to the unique physical configuration of the adaptor (closely spaced at one end), a mixed coplanar-to-connector measurement technique is needed to obtain the RF characteristics. To the knowledge of the authors, this problem has not previously been studied. After the RF characteristics of the adaptor are obtained herein, the RF performance of SMA connectors, either in-plane (horizontal), or out-of-plane (vertical), is extracted. We found that the horizontally and vertically oriented SMA connectors introduced additional delay, attenuation, and mismatch to the planar traces on the test board. The measurements were made up to 12 GHz.
机译:在这项研究中,进行了短开-负载互易(SOLR)校准程序,以获取测试板上适配器的RF特性(封装边缘与SMA连接器之间的走线)。 RF特性用于后处理技术中,以获得封装内部IC的真实RF性能。由于适配器的独特物理配置(在一端紧密隔开),因此需要使用混合的共面到连接器测量技术来获得RF特性。据作者所知,以前没有研究过此问题。在此处获得适配器的RF特性之后,将提取SMA连接器的平面(水平)或平面外(垂直)的RF性能。我们发现,水平和垂直方向的SMA连接器为测试板上的平面走线引入了额外的延迟,衰减和不匹配。进行了高达12 GHz的测量。

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