首页> 外文会议>61st Electronic Components Technology Conference, 2011 >Compact 3D integrable SU8 embedded microwave bandpass filters using complementary split ring resonator loaded half mode substrate integrated waveguide
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Compact 3D integrable SU8 embedded microwave bandpass filters using complementary split ring resonator loaded half mode substrate integrated waveguide

机译:紧凑型3D可集成SU8嵌入式微波带通滤波器,使用互补的开环谐振器加载的半模衬底集成波导

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A 3D integrable, compact SU8 epoxy embedded evanescent wave half mode substrate integrated waveguide (HMSIW) microwave resonator and a bandpass filter at 12GHz (Ku band) have been designed and fabricated by using a multilayer surface micromachining fabrication process. Evanescent wave amplification with forward transmission below the characteristic waveguide cutoff frequency is achieved with the use of complementary split ring resonators (CSRR) loaded on the top surface of a half mode substrate integrated waveguide, resulting in compact resonators with controllable Q factor and dual band operation capability. The use of the photopatternable SU8 epoxy as the dielectric for implementing the embedded RF passive devices enables tall vertical interconnects and multilayer 3D passives with high-Q factors, the integration of MEMS devices on CMOS circuits with its low temperature capability, and batch fabrication of multiple devices. Full wave electromagnetic simulations shows promising results at 12GHz, with a Q factor of 12 to 19 and a great size reduction of more than 50% when compared with conventional PCB implementations.
机译:通过使用多层表面微加工制造工艺,设计和制造了3D可集成,紧凑型SU8环氧树脂嵌入式e逝波半模衬底集成波导(HMSIW)微波谐振器和12GHz(Ku波段)的带通滤波器。通过在半模基片集成波导的顶面上装载互补的裂环谐振器(CSRR),可以实现在低于特征波导截止频率的情况下进行正向传输的van逝波放大,从而形成具有可控Q因子和双频工作的紧凑型谐振器能力。使用可光图案化的SU8环氧树脂作为电介质来实现嵌入式RF无源器件,可以实现高垂直互连和具有高Q因子的多层3D无源器件,具有低温能力的MEMS器件与CMOS电路的集成,以及批量制造多个设备。全波电磁仿真显示了在12GHz时有希望的结果,Q因子为12到19,与传统的PCB实施相比,尺寸减小了50%以上。

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