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Effects of bonding parameters and ACF material properties on the ACF joint morphology in ultrasonic bonding

机译:超声粘接中粘接参数和ACF材料性能对ACF接头形态的影响

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In this study, effects of bonding parameters and ACF material properties on the ACF joint morphology were investigated to understand influencing factors for a stable ACF joint in US bonding. According to the experimental results, the morphology of acrylic-based ACFs with 8 um diameter particles significantly changed as the bonding parameters changed due to high viscosity and fast curing rate. However, epoxy-based ACFs showed similar joint morphologies regardless of bonding parameters due to low viscosity and slow curing rate. As the bonding temperature increased from 150°C to 250°C, ACF joint gaps of the acrylic-based ACFs increased up to 12 um due to a smaller resin flow by a faster curing rate at higher temperatures. At 200°C constant bonding temperature, the ACF joint gaps decreased from 7 um to 2 um with increasing bonding pressure in the range of 2MPa to 4MPa due to a larger resin flow at higher bonding pressures. This result indicates that higher bonding pressure is desirable for high­speed bonding at high temperatures using acrylic-based ACFs. However, Acrylic-based ACFs with 20 um diameter particles can be a simple solution for high-speed bonding because they showed stable particle contacts due to a large particle size than ACF joint gaps regardless of bonding parameters.
机译:在这项研究中,研究了粘结参数和ACF材料性能对ACF接头形态的影响,以了解影响美国粘结中稳定的ACF接头的影响因素。根据实验结果,由于高粘度和快速固化速度,随着粘结参数的变化,具有8 um直径颗粒的丙烯酸基ACF的形貌发生了显着变化。然而,由于低粘度和缓慢的固化速度,基于环氧树脂的ACF表现出相似的接头形态,而与粘结参数无关。随着键合温度从150°C升高至250°C,丙烯酸类ACF的ACF缝隙增加至12 um,这是由于在较高温度下以更快的固化速率产生的树脂流量较小时,ACF的缝隙增大。在200°C的恒定粘结温度下,由于在较高的粘结压力下会有较大的树脂流量,随着2MPa至4MPa范围内的粘结压力的增加,ACF的缝隙从7 um减小到2 um。该结果表明,较高的粘合压力对于使用丙烯酸类ACF在高温下进行高速粘合是理想的。但是,具有20 um直径的颗粒的丙烯酸基ACF可以是高速粘合的简单解决方案,因为它们具有稳定的颗粒接触,这是因为与ACF接头间隙相比,其颗粒尺寸大,而与粘合参数无关。

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