Analysis of Thermal Hazard and Inherent Safety for Ethylbenzene by DSC and TAM Ⅲ

摘要

This study aimed at determining the inherent safety parameters of half-finished and finished materials of ethylbenzene, which is employed in the manufacturing process of the semiconductor industry. Through thermal scanning tests by differential scanning calorimetry (DSC), some essetial thermokinetics parameters, such as onset temperatue (TO), maximum temperature (Tmax), heat of decomposition (Hd), were obtained. Other safety parameters included temperature of no return (TNR), time to maximum rate (TMR), and self-accelerating decomposition temperature (SADT), which were acquired by thermal activity monitor Ⅲ (TAM Ⅲ). The results acquired by DSC and TAM Ⅲ not only present the thermal polymerization of ethylbenzene, but also can prevent hazards during the period of processing, storage, and transportation by appling the safety parameters.