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Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin

机译:胺封端的聚酯酰亚胺作为环氧树脂的改性剂的制备,液晶性能和热力学性能

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Epoxy resin is widely used in electronic packaging. However, neat epoxy resin is no suitable for high-performance applications because of its poor thermal stability and toughness. Polyimide is a kind of materials with high performance for their excellent thermal stability, dimensional stability and electric property, but it is generally insoluble and infusible, and this makes it difficult to process. In this study, Amine-terminated polyesterimide (ATPEI) polymers was synthesized and used as modifier of epoxy resin. The chemical structure of ATPEI was characterized by FT-IR spectrum. The two melting peaks of differential scanning calorimetry (DSC) show ATPEI manifested liquid crystal properties, which could be verified by Polarizing microscope (POM) and X-ray diffraction (XRD) respectively. ATPEI was used to improve the thermostability, mechanical properties and especially the toughness of bisphenol A diglycidyl ether epoxy resin(ER) cured with 4,4''-Methylenedianiline (DDM). The results show that the decomposition temperature of modified materials improve about 30°C compared with that of unmodified epoxy resin. The mechanical and dynamic mechanical properties were measured by universal testing machine and DMA. The results exhibit that ATPEI modified epoxy resin has good toughness.
机译:环氧树脂广泛用于电子包装。然而,纯净的环氧树脂由于其差的热稳定性和韧性而不适用于高性能应用。聚酰亚胺是一种具有优异的热稳定性,尺寸稳定性和电性能的高性能材料,但是它通常是不溶的和不熔的,这使其难以加工。在这项研究中,合成了胺端基的聚酯酰亚胺(ATPEI)聚合物,并将其用作环氧树脂的改性剂。通过FT-IR光谱表征ATPEI的化学结构。差示扫描量热法(DSC)的两个熔融峰显示了ATPEI表现出的液晶性能,可以分别通过偏光显微镜(POM)和X射线衍射(XRD)进行验证。 ATPEI用于提高用4,4''-亚甲基二苯胺(DDM)固化的双酚A二缩水甘油醚环氧树脂(ER)的热稳定性,机械性能,尤其是其韧性。结果表明,与未改性的环氧树脂相比,改性材料的分解温度提高了约30℃。力学性能和动态力学性能通过通用测试仪和DMA进行测量。结果表明,ATPEI改性的环氧树脂具有良好的韧性。

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