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Effect of Hydrogen Content on Superplastic Forming and Diffusion Bonding in Ti600 Alloy

机译:氢含量对Ti600合金超塑性形成和扩散键合的影响

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The superplastic forming and diffusion bonding (SPF/DB) of hydrogenated Ti-6A1-2.8Sn-4Zr-0.5Mo-0.4Si-0.1Y (Ti600) alloys were carried out in the temperature range of 1073-1213K under 1.5MPa gas pressure. The effects of hydrogen contents and diffusion temperature on welding-on ratio of SPF/DB and microstructure of interface and matrix in Ti600 alloy were investigated by OM and SEM. According to the experimental investigation, when the parameters of SPF/DB were as follows: T=860°C, P=1.5MPa and t=70min, the welding-on ratio of Ti600 alloy with hydrogen 0.5wt% was 100 percent. However, the physical contact of Ti600 alloy without hydrogen which was related to plastic forming could not occur. Moreover, the size and amount of voids at the diffusion bonding interface decreased and diffusion bonding quality improved gradually with the increase of hydrogen content and diffusion temperature, which was attributed to the decrease of phase transformation temperature and flow stress of plastic forming as well as the release of hydrogen. After SPF/DB, the recrystallization of joint grains through the interface was formed, and the matrix of hydrogenated Ti600 alloy changed.
机译:氢化Ti-6A1-2.8Sn-4Zr-0.5Mo-0.4Si-0.1Y(Ti600)合金的超塑性形成和扩散键合(SPF / DB)在1073-1213K的温度范围内,气压为1.5MPa的情况下进行。通过OM和SEM研究了氢含量和扩散温度对SP600 / DB焊接比和Ti600合金界面和基体组织的影响。根据实验研究,当SPF / DB的参数为T = 860°C,P = 1.5MPa和t = 70min时,Ti600合金与0.5wt%的氢的焊接率为100%。但是,没有发生与塑性形成有关的无氢的Ti600合金的物理接触。此外,随着氢含量和扩散温度的升高,扩散键界面处的空洞尺寸和数量减少,扩散键合质量逐渐提高,这归因于相变温度和塑性成形流动应力的降低。释放氢。 SPF / DB后,通过界面形成了接头晶粒的再结晶,并且氢化的Ti600合金的基体发生了变化。

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