A LOW-ORDER THERMAL BRIDGE DYNAMIC MODEL FOR BUILDING SIMULATION

摘要

The heat transfer characteristics in building window frame have significant three-dimensional characteristics, but window U-value model are often used in most building codes for thermal analyses to simplify the calculations. State model reduction techniques were used to develop low-order three-dimensional heat transfer model for window frame, which is efficient and accuracy. The method was validated for a envelope designs by comparing the with complete 3-D models.