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High sensitiv AC chip calorimetry for nanogram samples

机译:高灵敏度AC芯片量热法用于纳米图样本

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Calorimetry is known as a very powerful tool for the characterization of a wide variety of materials and their transitions. There is an ongoing interest in improving the technique in order to achieve high sensitivity and precision. High sensitive differential scanning calorimeters are developed mainly to measure biological samples showing small effects in highly diluted systems, e.g. (1). For reduced sample masses AC-calorimetric techniques are used in this field too (2). For more than 30 years, AC-calorimetry has been known as a sensitive technique to measure thermophysical properties of small sized samples. To further increase sensitivity a differential AC-calorimeter was developed too (3). In order to allow measurements on sub micron films addenda heat capacity has to be reduced dramatically. The combination of silicon technology and calorimetry opens up new possibilities in this research area as demonstrated recently (4). The thin membrane allows a good ratio between sample and addenda heat capacity for sub micron films. Different chip calorimeters as from Xensor Integrations, NL are used for samples in the microgram range, but also specialized home made sensors for nanogram samples (5). Using chip calorimeter in high vacuum under essentially adiabatic conditions the glass transition in polymer films down to 3 nm is measured (5). This is realized using a fast scanning calorimeter at heating rates up to 1 000 000 K/s. Also differential setups are possible with this technique. Because of the essentially adiabatic conditions only measurements at rapid heating are possible. Thin film calorimeter operated under non-adiabatic conditions allow heating as well as cooling at rates up to 10.000 K/s (6) and possibly faster. Using such high rates yield often non-equilibrium states of the sample under investigation. As an example, for several fast crystallizing polymers it is possible to prevent crystallization on cooling totally and to reach the amorphous glassy state (6). But often one would prefer to measure thermal properties of small samples at or at least close to thermodynamic equilibrium. This can be achieved by a combination of chip calorimetry and AC calorimetry (4). As common in AC calorimetry a small periodic heat flow is provided and the resulting complex temperature amplitude is measured. The measurements are done at slow scanning or at constant bath temperature. The frequency chosen provides a well defined time scale of the experiment. In several cases, e.g. at glass transition, a direct comparison with results from other dynamic methods like dielectric spectroscopy is possible. Such an AC-chip calorimeter for small samples using a single commercially available sensor under non-adiabatic conditions is described in (7). The sensitivity of this system is about 10 nJ/K at room temperature. This setup would allow measuring the glass transition of polymer films down to 500 nm thickness. For measuring the glass transition of much thinner polymer films the sensitivity of the calorimeter has to be enhanced. Based on a differential AC-calorimeter we show an improved experimental setup (see figure 1) combining the advantages of the different methods already described (8). The differential AC chip calorimeter is based on a commercially available chip sensor from Xensor Integrations, NL, which was already used in (7, 9) for AC and in (6, 10) for fast scanning calorimetry. Due to the differential setup we achieve a sensitive in the pico Joule per Kelvin range allowing to measure samples below one nanogram. Consequently films down to 1 nm thickness can be measured. Because of the small total heat capacity (addenda + sample) not only a high sensitivity is achieved but AC measurements at relative high frequencies are possible too (9). The calorimeter allows heat capacity measurements in the frequency range 1 Hz to 1 kHz.
机译:热量测定法被称为一个非常强大的工具,用于表征各种各样的材料及其过渡。有持续的兴趣改善了技术,以实现高灵敏度和精度。高敏感差分扫描量热计主要是为了测量在高度稀释的系统中显示出小效果的生物样品,例如, (1)。对于降低的样本,质量在该字段中使用AC-量热技术(2)。超过30年,已知AC-热量测定为测量小型样品的热物理性质的敏感技术。为了进一步提高敏感性,还开发了差分交流量计(3)。为了允许对亚微米膜的测量,必须显着降低加热能力。硅技术和量热法的组合在本研究领域开辟了新的可能性,如最近(4)所示。薄膜允许样品与亚微米膜的加热能量之间的良好比率。从Xensor集成的不同芯片量热计,NL用于微克范围内的样品,而且还用于纳米图样本的专业自制传感器(5)。在基本绝热条件下使用芯片量热表在基本绝热条件下,测量聚合物薄膜中的玻璃化转变为3nm(5)。这是使用快速扫描量热计实现,加热速率高达1000 000 k / s。这种技术也可以进行差异设置。由于基本上绝热的条件,仅可能在快速加热时进行测量。在非绝热条件下操作的薄膜量热计允许加热以及在速率下冷却,高达10.000 k / s(6),并且可能更快。使用这种高速率产量通常在调查中的样品的非平衡状态。作为一个例子,对于几种快速结晶的聚合物,可以防止结晶完全冷却并达到无定形玻璃状状态(6)。但通常人们宁愿在至少接近热力学平衡时测量小样品的热性质。这可以通过芯片量热法和AC量热法(4)的组合来实现。通常在AC量热法中,提供小的周期性热流,并测量所得到的复温幅度。测量在慢扫描或恒定的浴温下进行。选择的频率提供了实验的明确定义的时间尺度。在几个情况下,例如在玻璃化转换中,可以将与介电光谱等其他动态方法的结果进行直接比较。在(7)中描述了在非绝热条件下使用单个市售传感器的小型样品的这种AC片热量计描述于(7)。该系统的敏感性在室温下约为10 nJ / k。该设置将允许测量聚合物膜的玻璃化转变为500nm厚度。为了测量较薄的聚合物膜的玻璃化转变,必须增强热量计的灵敏度。基于差分交流量热计,我们显示了一种改进的实验设置(参见图1),其组合已经描述的不同方法的优点(8)。差分交流芯片量热计基于来自Xensor集成的市售芯片传感器,该传感器,NL已经用于(7,9),用于AC和(6,10),用于快速扫描量热法。由于差异设置,我们在每克伦范围内达到微微焦耳敏感,允许测量一个纳米图低于一个纳米图。因此,可以测量下达1nm厚度的薄膜。由于总热容量较小(addenda +样品)不仅实现了高灵敏度,而且还可以实现高频率的AC测量(9)。量热计允许频率范围内的热容量测量为1 Hz至1 kHz。

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