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New developments in the field of MF-sputtering with dual magnetron to obtaiin higher productivity for large area coatings

机译:用双磁控溅射MF溅射领域的新发展,为大面积涂层振动提高生产力

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The introduction of the dual magnetron sputtering technology entered new applcations in the field of large area coatings of glass and plastics. Materials like SiO_2, Si_3N_4 or TiO_2 for antirefective coatings of highe quality low-e systems are now deposited faster than with the standard DC Magnetron Cathode. The successful introduction of the dual mangetron in several coating lines demands further progress towards even higher productivity of the sputtering tool. A second dual mangetron generation was developed with anew magnetric field. The cathode was designed and optimized by focusing on the actively sputtered zone ("race-track") of the target. High target utilization and target life time have been achieved with a large target surface.
机译:推出双磁控溅射技术进入了玻璃和塑料大面积涂层领域的新涂层。 对于高质量的低E系统的防触发涂层的SiO_2,Si_3N_4或TiO_2如SiO_2,Si_3N_4或TiO_2,比标准DC磁控管阴极更快地沉积。 在几种涂层线中成功引入双人龟头的介绍需要进一步进展溅射工具的更高生产率。 使用重新磁场开发了第二种双人大海群生成。 通过专注于目标的主动溅射区(“赛道”)设计和优化了阴极。 已经通过大目标表面实现了高目标利用率和目标寿命。

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