New technolgy hot melt adhesives with outstanding performance- the hot melt adhesives of tomorrow

摘要

We have develpoed new hot melt adhesives that show superior performance over current industry standards. These hot melts are designed for the paper and packaging market and offer virtually trouble free operation. They do not develop char-which may lead to costly downtime, nor do they significantly increase in viscosity over time. This leads to a very consistent application of hot melt adhesive. They also show superior bonding character over commercially available products of today. A review of the characteristics and performance of these new products is the goal of this paper.