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Chip assembly

机译:芯片组件

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摘要

Design teams designing modern multi-million gate systems-on-chip (SoCs) are being adversely affected by the lack of desired chip assembly solutions in addition to the challenges due to variability in nanometer technologies. Abstractions, bad pin assignments, incorrect block budgets, incorrect clock insertion delay budgets, lack of variability aware analysis engines, and lack of concurrent optimization capabilities often lead to chip failures, reduced yield, missed schedule and lost performance.Due to the late surprises in chip assembly, design teams have rushed to incorporate chip assembly as part of concurrent engineering with the block implementation. A new paradigm and tool set that enables efficient multi-million gate chip assembly while concurrently analyzing and optimizing across all variability scenarios is critical for nanometer hierarchical flows.In this paper we will review chip assembly challenges and discuss the requirements of an implementation system that comprehensively addresses all the issues.
机译:设计团队设计现代多百万型栅极系统(SOC)由于缺乏所需的芯片组装解决方案,除了由于纳米技术的可变性而缺乏所需的芯片组装解决方案也受到不利影响。抽象,坏的PIN分配,块预算不正确,时钟插入延迟预算,缺乏可变性感知分析引擎,并且缺乏并发优化能力通常导致芯片故障,降低产量,错过的时间表和丢失的表现。到后期惊喜芯片组件,设计团队急于将芯片组件合并为具有块实现的并发工程的一部分。一种新的范例和工具集,可实现高效的多百万门芯片芯片组件,同时分析和优化所有可变形方案对于纳米分层流程至关重要。本文将审查芯片组装挑战并讨论全面的实施系统的要求解决所有问题。

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