Design methodology and tools for NEC electronics' structured ASIC ISSP

摘要

In this paper, we describe a design methodology and tools for NEC Electronics' structured ASIC, Instant Silicon Solution Platform (ISSP), which is being developed to fill the gap between FPGAs and standard cell-based ASICs. The ISSP has a unique regular-fabric architecture designed to achieve both a short time to production and high-performance LSI design. We have developed a special design methodology and tools to fully exploit the capability of this new device. Experimental results for industrial data show that our approach has advantages for ISSP design.