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High-speed low-loss large-fan-out optoelectronic clock distribution networks on multichip modules by using silica glass waveguides and silicon microstructures

机译:采用二氧化硅玻璃波导和硅微观结构,高速低损耗大型扇出光电子分配网络

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Guided-wave optoelectronic clock distribution networks on multichip modules (MCMs) are designed and fabricated to meet the high-speed clocking requirements of next-generation digital systems through a realization of superior network bandwidth, low power consumption, and large fanout capabilities compared to electrical interconnect counterparts. The sixteen-fanout H-tree clock distribution networks on MCMs is demonstrated by combining silica glass waveguides and micromachined silicon microstructures. The proposed optoelectronic multichip modules (OE-MCMs) with silica glass networks can be fabricated in a CMOS compatible batch process without modifying the conventional IC fabrication facilities. The proposed OE-MCM assembly/packaging processes are simple and cost-effective by sing self-alignment silicon microstructures. The design issues of optoelectronic H-tree networks and micromachined alignment structures for assembly/packaging processes are presented and discussed to improve the overall system performance while minimizing the system cost. The silica glass clock distribution networks and mosaic silicon mirror arrays are characterized at wavelengths of 1310 nm and 1550 nm by measuring overall optical power losses and signal uniformity. !
机译:设计和制造多芯片模块(MCM)上的引导波光电时钟分配网络,以满足下一代数字系统的高速时钟要求,通过实现卓越的网络带宽,低功耗和大型扇出功能与电气相比。互连对应物。通过组合石英玻璃波导和微机械硅微结构来证明MCMS上的十六扇门H-Tree时钟分配网络。具有二氧化硅玻璃网的所提出的光电多芯片模块(OE-MCM)可以在CMOS兼容的批处理过程中制造,而不改变传统的IC制造设施。所提出的OE-MCM组装/包装工艺通过SING自对准硅组织简单且经济效益。展示和讨论了用于组装/包装过程的光电H树网络和微机械对准结构的设计问题,以提高整体系统性能,同时最小化系统成本。通过测量整体光功率损耗和信号均匀性,二氧化硅玻璃时钟分配网络和马赛克硅镜阵列的特征在于1310nm和1550nm的波长。 !!

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