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Crystalline properties of ferroelectric-relaxor PMN-PT thin films by pulsed laser deposition

机译:脉冲激光沉积铁电弛豫PMN-PT薄膜的结晶特性

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The dielectric and crystalline properties of ferroelectric thin films of 0.9[Pb(Mg/sub 1/3/Nb/sub 2/3/)O/sub 3/]-0.1PbTiO/sub 3/ (.9PMN-.1PT) have been investigated. Ceramic targets of 0.9PMN-0.1PT with and without excess PbO were used for thin film deposition and were grown on substrates of SrTiO/sub 3/ LaAlO/sub 3/, MgO, and Pt/TiO/sub 2//SiO/sub 2//Si using pulsed laser ablation deposition. It was shown that the phase purity of the films was dependent on the film thickness. Furthermore we have shown that as the thickness of the films increases from 100nm to 600nm there is a progressive decline in the local strain and hence an improvement in the local crystallinity of the films. The dielectric constant for our films (3900 at 10KHz) is higher than previous reports on 0.9PMN-0.1PT films. We have also shown that there is considerable benefit in changing lower electrodes. The XRD shows that the films are highly c-axis orientated as grown on YBa/sub 2/Cu/sub 3/O/sub 7/ (001) or SrRuO/sub 3/ (001) and (111) orientated on Pt(111) lower electrodes. The sizes of the grains depend upon the nucleation density and the rate of growth onto the lower electrode used. Slower growth rates lead to excess of lead in the film at the grain boundaries while accelerated growth rates lead to higher porosity's. It was shown that annealing for 1 hour at 600/spl deg/C reduces porosity and improves surface quality.
机译:0.9 [Pb(Mg / sub 1/3 / Nb / sub 2/3 /)O / sub 3 /]-0.1PbTiO / sub 3 /(.9PMN-.1PT)的铁电薄膜的介电和晶体性质被调查了。含和不含过量PbO的0.9PMN-0.1PT陶瓷靶材均用于薄膜沉积,并在SrTiO / sub 3 / LaAlO / sub 3 /,MgO和Pt / TiO / sub 2 // SiO / sub的基板上生长2 // Si使用脉冲激光烧蚀沉积。结果表明,薄膜的相纯度取决于薄膜的厚度。此外,我们已经表明,随着膜的厚度从100nm增加到600nm,局部应变逐渐下降,因此膜的局部结晶度得到改善。我们的薄膜的介电常数(在10KHz时为3900)高于先前在0.9PMN-0.1PT薄膜上的报道。我们还表明,更换下部电极有很大的好处。 X射线衍射表明,随着YBa / sub 2 / Cu / sub 3 / O / sub 7 /(001)或SrRuO / sub 3 /(001)和(111)在Pt( 111)下电极。晶粒的尺寸取决于成核密度和在所使用的下部电极上的生长速率。较慢的生长速度会导致薄膜中晶界处的铅过量,而加速的生长速度则会导致孔隙率增加。结果表明,以600 / spl deg / C的温度退火1小时可降低孔隙率并改善表面质量。

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