SURFACE AND BULK MIXED SILICON MICROMACHINING EMPLOYED IN MANUFACTURING A NOVEL TORSION-MIRROR MICROACTUATOR WITH COMPOUND ELECTROSTATIC DRIVING STRUCTURE

摘要

A new kind of torsion-mirror microactuators with compound electrostatic driving structures is reported. The advanced compound driving structures are made up of plate-electrode couple drives and vertical comb drives. A set of surface-and-bulk-mixed-silicon-micromachining process has been developed to manufacture the novel torsion-mirror microactuators in SOI wafers. In the processing, the comb fingers of about 170 μm in depth are able to be produced. Measurements and analyses manifest that the compound driving structures can actuate mirrors to achieve not only large-range continuous rotation but also 90° rotation. The electrostatic threshold voltages for achieving 90° rotation of the micro torsion-mirrors are found from 80 to 120 V.