Challenges for Point-of-Load Integrated Module Manufacturers

摘要

The migration to intermediate bus architectures (3.3V, 5V or 12V) is driving an increase in the use of non-isolated point-of-load (POL) modules suitable for requirements in telecom, datacom and computer applications. As OEM designers seek to maximize system performance, power module suppliers are responding with advanced POL modules that incorporate new sequencing technology, high power density and high efficiency. This paper will discuss how power supply manufacturers face the challenge of packaging these and other features in POL modules with footprints as small as 0.49 in~2.