600 V IGBT~3-Technology in New Low Cost Modules for Consumer Drives Applications

摘要

The increasing demand for comfortable but low cost consumer products has driven the development of 600V IGBT~3 and a new ultra-compact Easy750 module platform. Using trench-fieldstop technology the IGBT~3 on-state voltage drop is reduced by 0.45 V as compared to IGBT~2. Moreover, the maximum junction temperature has been risen to 175℃. The Easy750 housing offers a well suited module concept for a compact and cost-effective integration of power semiconductors. With a footprint of 25 x 36 mm~2 various circuit topologies are offered, e.g. a sixpack configuration (max 30 A / 600V) or a PIM configuration (max. 15 A / 600 V). The module is easily mounted by using a reliable single clamp.