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HIGH QUALITY REFLOW SOLDERING WITH VAPOR PHASE THE NEW APPROACH OF VAPOR PHASE TECHNOLOGY

机译:气相相高质量回流焊气相相技术的新方法

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Vapor Phase Soldering is known today as one of the provenrnreflow soldering methods, however it is still seen beingrnexotic to many users and also the discussions on benefitsrnand shortfalls are not necessarily considering today′srntechnology.rnThe Vapor Phase process was reinvented in the 90srnovercoming the challenges of the original process. Based onrnthis renewed Vapor Phase procedure, various new machinesrnwere developed. Vapor Phase Soldering now offers newrnfeatures, in particular when it comes to lead free soldering.rnThe main advantages of a state of the art Vapor Phasernsystem are low process temperatures, freely adjustablerntemperature gradients and profiles, automatically controlledrntime above liquidus and a perfectly inert process atmospherernwithout using cost intensive protective gas measures.rnThe task in reflow soldering is to evenly heat up PCBrnboards to a level that soldering can be accomplished even onrnsockets or in the center of large BGA’s but at the same timernto be sure that nothing is overheated or delaminated. Sornespecially for lead free soldering the process windowrnbecomes pretty small. With Vapor Phase Soldering evenrnFR4 boards, double sided densely packed, can be solderedrnreliably and with no danger of overheating since thernmaximum board temperature is physically limited to thernvapor temperature (e.g. 230-235°C for lead-free SnAgCu).rnBecause of it′s perfect inert atmosphere the wetting withrnlead free solder paste in a Vapor Phase oven is the bestrnpossible wetting today. A thorough temperature gradientrncontrol in Vapor Phase becomes crucial as soon asrntombstoning is becoming immanent in the process. Like inrnconvection reflow, the sensitivity of tombstoning isrnsignificantly influenced by the temperature profile.rnThe advantages of the Vapor Phase heat transfer inrncombination with new machines and options offer anrnexcellent tool for easy and defect free reflow soldering,rnindependent whether lead free or leaded solders are used.
机译:汽相焊接是当今公认的回流焊方法之一,但仍被许多用户所接受,关于益处和不足的讨论也不必考虑当今的技术。在90年代重新发明了汽相工艺,克服了挑战原始过程。在此更新的气相阶段程序的基础上,开发了各种新机器。蒸汽相焊接现在提供了新的功能,尤其是在无铅焊接方面。最新的蒸汽相系统的主要优点是过程温度低,温度梯度和轮廓可自由调节,液相线以上的时间自动控制以及完全惰性的过程气氛而无需使用成本高昂的保护性气体措施。回流焊接的任务是将PCB板均匀加热到可以在插座或大型BGA的中心进行焊接的水平,但同时要确保没有过热或分层。特别是对于无铅焊接,工艺窗口变得很小。使用双面汽相焊接甚至均匀填充的FRFR4板,可以可靠地进行焊接,并且没有过热的危险,因为板的最高温度实际上限制在蒸汽温度范围内(例如,无铅SnAgCu的温度为230-235°C)。完美的惰性气氛在汽相炉中润湿无铅无铅焊膏是当今最好的润湿方法。一旦在该过程中突然出现爆震现象,在气相中进行彻底的温度梯度控制就变得至关重要。与对流回流一样,墓碑的敏感性也受温度曲线的显着影响。蒸气相传热与新机器和选件相结合的优点提供了出色的工具,可轻松,无缺陷地进行回流焊接,而与使用无铅焊料或含铅焊料无关。

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