首页> 外文会议>International Conference on Processing amp; Manufacturing of Advanced Materials; 20060704-08; Vancouver(CA) >Microstructure and Thermoelectric Properties of Rapidly Solidified and Hot Pressed N-Type 95Bi_2Te_3-5Bi_2Se_3 Alloys
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Microstructure and Thermoelectric Properties of Rapidly Solidified and Hot Pressed N-Type 95Bi_2Te_3-5Bi_2Se_3 Alloys

机译:快速凝固和热压N型95%Bi_2Te_3-5%Bi_2Se_3合金的组织和热电性能

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摘要

N-type 0.05wt% SbI_3-doped Bi_2Te_(2.85)Se_(0.15) compounds were fabricated by gas atomizing and hot pressing. The as-fabricated powder consists of homogeneous Bi_2Te_3+Bi_2Se_3 solid solution and a maximum theoretical density of 98.9% was obtained after hot pressing, resulting in improvement of compression strength up to 4-5 times of the conventionally prepared single crystal thermoelectric material. The values of the Seebeck coefficient for hot pressed specimens vertical of the pressing direction with small and large powder size were -178 and -218μV/K, respectively. The values of the electrical resistivity for hot pressed specimens vertical of the pressing direction with small and large powder with small and large powder size were 1.245 and 1.728 × 10~(-5) Ω m, respectively.
机译:通过气体雾化和热压制备了N型0.05wt%的SbI_3掺杂Bi_2Te_(2.85)Se_(0.15)化合物。制成的粉末由均匀的Bi_2Te_3 + Bi_2Se_3固溶体组成,热压后的最大理论密度为98.9%,压缩强度提高到常规制备的单晶热电材料的4-5倍。粉末尺寸较小和较大时,与压制方向垂直的热压试样的塞贝克系数分别为-178和-218μV/ K。在粉末大小的情况下,大小粉末的热压试样垂直于压制方向的电阻率分别为1.245和1.728×10〜(-5)Ωm。

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