Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect

摘要

This work concerns the thermal analysis of solid state devices, namely the solution of the heat transfer problem as part of the coupled electrical-thermal analysis of an IC. We investigate some typical numerical problems which can be found during evaluating of the tune dependent solution of the heat diffusion equation for a 3D finite domain with an uniform heat source. Considering a surface heat source, the solutions obtained by means of the Large Time Greens Function and Small Time Greens Function are studied. A simple method to improve the computational efficiency is proposed. A comparison of different approaches is given as well.