Division of Physical Metrology, Korea Research Institute of Standards and Science (KRISS), 267 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340,Measurement of Science, University of Science and Technology(UST), 217 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340;
Division of Physical Metrology, Korea Research Institute of Standards and Science (KRISS), 267 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340;
Division of Physical Metrology, Korea Research Institute of Standards and Science (KRISS), 267 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340,Measurement of Science, University of Science and Technology(UST), 217 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340;
Division of Physical Metrology, Korea Research Institute of Standards and Science (KRISS), 267 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340;
Division of Physical Metrology, Korea Research Institute of Standards and Science (KRISS), 267 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340,Measurement of Science, University of Science and Technology(UST), 217 Gajeong-ro, Yuseong-gu, Daejeon, Republic of Korea 305-340;
uncertainty evaluation; silicon wafer; geometric thickness; refractive index; femtosecond pulse laser;
机译:通过光谱分辨干涉仪测量的硅晶片的厚度和翘曲的不确定性评估
机译:飞秒脉冲激光光学梳测量硅片的厚度分布和折射率变化
机译:硅晶片上SIO2膜的厚度,折射率,光学各向异性和应力的测定
机译:硅晶片几何厚度和折射率的不确定性评价
机译:使用原位椭偏仪在快速热处理中测量和控制硅片温度和氧化膜厚度。
机译:硅晶片双面抛光系统中基于激光的厚度控制
机译:测量半导体晶片折射率和材料厚度独立值的顺序干涉技术