SOLDER BUMPING - A FLEXIBLE JOINING APPROACH FOR THE PRECISION ASSEMBLY OF OPTOELECTRONICAL SYSTEMS

摘要

For microoptics and microsystem assembly, solder bumping is introduced as a flexible and high precise joining alternative to adhesive bonding, especially if adhesives limit the system performance in terms of long term, high temperature, vacuum or UV stability. The bumping technology, which is based on jetting the liquid solder onto wetting surfaces, can be parameter optimised to work in complex environments as well as with submicron accuracy.