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Internal Arc Fault Simulation in Medium Voltage Panel for Thermal and Structural Withstand

机译:中压板内部电弧故障模拟的热力和结构耐受性

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During an event of internal arc fault in MV switchgears electrical energy of the order of several MJ is released, major portion of which is utilized in heating the enclosure gases resulting in significant temperature and pressure rise inside the chamber. An internal arc simulation model is developed to investigate various arc parameters such as pressure rise in compartments, exhaust gas temperature, temperature at indicator plane, pressure on panel walls and structural withstand. This simulation model has been developed to improve design efficiency, safety and specially to minimize the need for physical testing. A 3-Dimensional CFD simulation of high temperature gases in switchgear panel is carried out taking into account the coupled interactions between flow, temperature, turbulence and radiation fields. Temperature and pressure rise due to internal arc at different locations in breaker, cable and busbar compartments are compared. Temperature rise at different locations on indicator walls are obtained from CFD. Panel enclosure structure should be able to withstand high pressure and temperature caused by arc fault. Overpressure due to arc fault can create significant mechanical stresses on the enclosure structure causing deformation of walls, doors getting blown out, failure at fastener location, etc. Pressure data obtained from CFD is used as an input to carry out stress analysis of the enclosure structure using FEA. Transient structural simulation is performed considering geometric and material non-linearity to obtain deformation and mechanical stresses on all walls. Results from FEA can be used for design qualification as well as for the optimal designing of structure and its components. Simulation model of a typical MV panel arrangement is discussed here.
机译:在MV开关设备发生内部电弧故障的情况下,释放出几MJ量级的电能,电能的大部分用于加热封闭气体,从而导致腔室内显着的温度升高和压力升高。开发了内部电弧仿真模型以研究各种电弧参数,例如车厢内的压力升高,废气温度,指示器平面上的温度,面板壁上的压力和结构承受力。开发该仿真模型的目的是提高设计效率,安全性,特别是最大程度地减少物理测试的需求。考虑到流量,温度,湍流和辐射场之间的耦合相互作用,对开关柜中的高温气体进行了三维CFD模拟。比较了断路器,电缆和母线室中不同位置的内部电弧引起的温度和压力上升。指示器壁上不同位置的温升可从CFD获得。面板外壳的结构应能承受电弧故障引起的高压和高温。电弧故障引起的过压会在外壳结构上产生巨大的机械应力,从而导致墙体变形,门被炸开,紧固件位置发生故障等。从CFD获得的压力数据将用作对外壳结构进行应力分析的输入使用FEA。考虑几何和材料非线性来执行瞬态结构仿真,以获得所有壁上的变形和机械应力。 FEA的结果可用于设计鉴定以及结构及其组件的最佳设计。这里讨论了典型的中压面板布置的仿真模型。

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