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Impacts of random telegraph noise on the analog properties of FinFET and trigate devices and Widlar current source

机译:电报噪声对FinFET和Trigate器件以及Widlar电流源的模拟特性的影响

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We investigate the impacts of the single charged trap induced Random Telegraph Noise (RTN) on the analog properties of FinFET and Trigate devices. A comprehensive comparative analysis between FinFET and Trigate device is carried out for the trap located along the channel length and fin height direction employing 3D atomistic TCAD simulations, and the resulting impacts on gm, ro, fT and Wildar current source examined. The results indicate that Trigate device, with larger (smaller) fraction of electron current flowing near the bottom (top) region of the fin, suffers larger (smaller) RTN degradation when the trap is located at the bottom (top) region of the fin. As such, the RTN amplitude in Trigate device has broader dispersion and stronger dependence on the location of the trap compared with FinFET device. For trap positioned along the channel length direction, the single trap located near the source region has the largest influence on the output resistance (Δro/ro) when the device operates at saturation region (VD= 1V), because the sensitivity of ID to ΔVD becomes higher as the potential barrier for carrier injection near the source is significantly perturbed. The variability of RTN Δgm/gm under fin Line Edge Roughness (LER) and Work Function Variation (WFV) is examined, and Trigate device is shown to exhibit larger nominal Δgm/gm and larger s(Δgm/gm). The Widlar current source is used as an example to illustrate the impacts of RTN on analog circuit. The combinations of trapping/detrapping in the current source device and mirroring/output device, and the dependence of ΔIout/Iout on their VGS difference are examined. The Trigate device exhibits larger ΔIout/Iout and larger s(ΔIout/Iout), and the di- ference between Trigate and FinFET becomes more significant with decreasing gate over-drive.
机译:我们研究了单电荷陷阱引起的随机电报噪声(RTN)对FinFET和Trigate器件的模拟性能的影响。 FinFET和Trigate器件之间的综合比较分析使用3D原子TCAD仿真技术对沿沟道长度和鳍片高度方向定位的阱进行了分析,并考察了其对gm,ro,fT和Wildar电流源的影响。结果表明,当陷阱位于鳍的底部(顶部)时,Trigate器件在鳍的底部(顶部)附近流过较大(较小)的电子电流,其RTN退化较大(较小)。 。因此,与FinFET器件相比,Trigate器件中的RTN幅度具有更宽的色散和对阱位置的依赖性。对于沿沟道长度方向设置的阱,当器件在饱和区域(VD = 1V)工作时,位于源极区域附近的单个阱对输出电阻(Δro/ ro)的影响最大,因为ID对ΔVD的敏感性由于在源附近注入载流子的潜在势垒受到严重干扰,因此变得更高。研究了鳍线边缘粗糙度(LER)和功函数变化(WFV)下的RTNΔgm/ gm的变化,并显示Trigate器件具有较大的标称Δgm/ gm和较大的s(Δgm/ gm)。以Widlar电流源为例来说明RTN对模拟电路的影响。检查了电流源设备和镜像/输出设备中的陷获/去陷获的组合,以及ΔIout/ Iout与其VGS差的相关性。 Trigate器件具有更大的ΔIout/ Iout和更大的s(ΔIout/ Iout),并且随着栅极过驱动程度的降低,Trigate和FinFET之间的差异变得更加重要。

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