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ANALYSIS TO REDUCE THERMAL STRESS IN OXIDE SINGLE CRYSTAL DURING CZOCHRALSKI GROWTH

机译:降低CCHOCHRALSKI生长过程中氧化物单晶热应力的分析

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摘要

Temperature distributions and thermal stress distributions in a semi-transparent GSO crystal during Czochralski (CZ) single crystal growth were numerically investigated by thermal radiation heat transfer analysis and anisotropy stress analysis. As GSO has special optical properties, such as semi-transparency at a wavelength shorter than 4.5 μm, thermal radiation heat transfer was calculated by the Monte Carlo method. These calculations showed that thermal stress is caused by the radial temperature distribution on the outside of the upper part of the crystal. To reduce this temperature distribution, the following three manufacturing conditions were found to be effective: use a sharp taper angle of the crystal, install a lid to the top of the insulator, and install a ring around the tapered part of the crystal.
机译:通过热辐射传热分析和各向异性应力分析,数值研究了Czochralski(CZ)单晶生长期间半透明GSO晶体中的温度分布和热应力分布。由于GSO具有特殊的光学特性,例如在小于4.5μm的波长下具有半透明性,因此通过蒙特卡洛方法计算了热辐射的热传递。这些计算表明,热应力是由晶体上部外部的径向温度分布引起的。为了降低这种温度分布,发现以下三个制造条件是有效的:使用尖锐的晶体锥角,在绝缘子的顶部安装一个盖子,并在晶体的锥形部分周围安装一个环。

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