AIR COOLING STUDY OF TRANSIENT NATURAL CONVECTION HEAT TRANSFER FROM SIMULATED ELECTRONIC CHIPS

摘要

Experiments are performed to study the heat transfer characteristics during the power-on transient period from an array of 4 x 1 discrete heat sources in a vertical rectangular channel using air as the working fluid. The heat flux ranges from 1000 W/m~2 to 5000 W/m~2. For 2 mm protrusion of the heater, the effect of heat fluxes and chip numbers are investigated and observed that the transient Nu_l strongly depends on the number of chips. Correlations are presented for individual chips as well as for overall data in the transient regime.