Simulation of silicon micromachined ultrasonic transducers

摘要

A general 3-D TDK model developed further in this paper has been successfully applied to simulate a surface micromachimned electrostatic or capacitive ultrasonic transducer with vacuum-sealed air-cavities (i.e cMUT). Also, the paper gives a reliable prediction of resonant and anti-resonant frequencies of a typical cMUT.