TSV THINNED WAFER DEBONDING PROCESS OPTIMIZATION

摘要

Interest in temporary bonding for wafer thinning and backside processing to finish through silicon vias for use in 3D packaging continues to gain broader interest throughout the semiconductor and packaging industries. The use of TSV's are likely to be first qualified in very high volume applications like memory or image sensor technology and then move into analog devices both for improved power and thermal efficiency as well as enabling increased electrical functionality.rnSeveral temporary bonding schemes have been proposed and tested, each with it's particular properties and advantages. One approach for temporary bonding, is based on a wafer by wafer bonding and debonding process by using thermoplastic polymeric-based spin-on material as temporary agent in the bond-interface. In this, single wafer processing approach, thinned wafer debonding requires careful process setup and optimization enabling the highest throughput and equipment utilization. For this work, researchers have teamed up to carefully set-up and analyze the slide debond process and define machine and materials physical requirements. The debond process is modeled using engineering analysis and empirical testing is used to confirm the model quality.rnThe paper will provide an overall introduction on the temporary bonding and debonding scheme, enabling processing of thin and ultra-thin wafers utilizing existing equipment and process platform. The bonding and debonding technology using Brewer Science HT-materials as intermediate layers and EVG's equipment platform are described in more detail. Extensive discussion of the thermally activated slide-off debond-process including mathematical modeling of material and process properties will conclude the paper.